Time：2021-04-09 Edit：小編Number hits：335
E5068c is a kind of nano modified one component low temperature heat curable epoxy adhesive, which has the advantages of one component, low temperature rapid curing, good transparency after curing, high bonding strength, strong flexibility, low shrinkage and so on. At the same time, it has excellent electrical performance, weather resistance and chemical resistance.
E5068c is suitable for bonding electronic or other products. It has strong bonding effect on copper, aluminum and other metals, ferrite, plastics, glass fiber reinforced plastics, pet, ceramics and other materials. Such as camera module COMS or CCD lens, micro motor, speaker, BGA fixing, chip, magnetic steel and other components bonding and packaging.
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